Electroless Nickel Plating
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Electroless Nickel Plating - Processes
Type Definition
Low Phosphorus
(1-3%P)
Stable, semi-bright. High as plated hardness and melting point. Excellent wear resistance. Compressive stressed, and susceptable to staining.
Nickel boron
(1-3%)
Stable, low boron, functional electroless nickel. Excellent solderablity and wear resistance. Ecelllent electrical resistivity properties over the life of the deposit.
Mid Phosphorus (5-9%P) Semi-bright, high speed process. Consistent rate. Stable, tolerant to impurities, easy to operate.
Mid Phosphorus
(5-9%P)
Very bright, high speed process. Consistent rate. Stable, tolerant to impurities, easy to operate.
High Phosphorus
(10.5-12%P)
Stable, easy to operate. Deposit is non-magnetic, smooth, pit-free, and very corrosion resistant.
High Phosphorus
(10.5-12%P)
High phosphorus process with modified complexor system. Faster rates, similar deposit properties.
High Phosphorus
(10.5-12%P)
High phosphorus process with modified stabilizer system. Ideal for low bath loading conditions.
Alkaline EN Low phosphorus EN process for plating on plastics
EN-Boron Nitride High hardness, high lubricity, long bath life, and high
plating rate.
EN-Teflon Stable, easy to operate, high plating rate and long bath life. Excellent deposit properties.
EN-Teflon Stable, easy to operate. Deposit is corrosion resistant and has excellent release and wear properties.
Duplex or Composite Nickel Coatins A combination of electrolytic nickel and electroless nickel or a sandwich of different phosphorous levels that provide better corrosion resistance or wear than single layer deposits
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