Electroless Nickel Plating - Processes
| Type | Definition |
| Low Phosphorus (1-3%P) |
Stable, semi-bright. High as plated hardness and melting point. Excellent wear resistance. Compressive stressed, and susceptable to staining. |
|
Nickel boron
(1-3%) |
Stable, low boron, functional electroless nickel. Excellent solderablity and wear resistance. Ecelllent electrical resistivity properties over the life of the deposit. |
| Mid Phosphorus (5-9%P) | Semi-bright, high speed process. Consistent rate. Stable, tolerant to impurities, easy to operate. |
| Mid Phosphorus (5-9%P) |
Very bright, high speed process. Consistent rate. Stable, tolerant to impurities, easy to operate. |
| High Phosphorus (10.5-12%P) |
Stable, easy to operate. Deposit is non-magnetic, smooth, pit-free, and very corrosion resistant. |
| High Phosphorus (10.5-12%P) |
High phosphorus process with modified complexor system. Faster rates, similar deposit properties. |
| High Phosphorus (10.5-12%P) |
High phosphorus process with modified stabilizer system. Ideal for low bath loading conditions. |
| Alkaline EN | Low phosphorus EN process for plating on plastics |
| EN-Boron Nitride | High hardness, high lubricity, long bath life, and high plating rate. |
| EN-Teflon | Stable, easy to operate, high plating rate and long bath life. Excellent deposit properties. |
| EN-Teflon | Stable, easy to operate. Deposit is corrosion resistant and has excellent release and wear properties. |
| Duplex or Composite Nickel Coatins | A combination of electrolytic nickel and electroless nickel or a sandwich of different phosphorous levels that provide better corrosion resistance or wear than single layer deposits |